Utilizing self-assembled multilayers in lithographic processing for nanostructure fabrication: Initial evaluation of the electrical integrity of nanogaps

M. E. Anderson, Charan Srinivasan, Raviprakesh Jayaraman, P. S. Weiss, M. W. Horn

Research output: Contribution to journalConference articlepeer-review

11 Scopus citations

Abstract

We apply self-assembly to form multilayers on gold structures formed by lithographic techniques to create patterns with spacings in the 10-100 nm regime. Controlled placement and thickness of these multilayers form "molecular ruler" resists to tailor spacings accurately between lithographically defined structures. We report on recent results both in designing and patterning complex nanostructures by combining photolithography and molecular rulers. After exposure, development, metal deposition, and lift-off of both the photoresist and molecular resist, the final product has secondary structures and gaps selectively oriented to create hierarchical nanostructures. The electrical integrity of the nanogaps formed using this process is evaluated for a variety of multilayer thicknesses and electrodes widths.

Original languageEnglish (US)
Pages (from-to)248-252
Number of pages5
JournalMicroelectronic Engineering
Volume78-79
Issue number1-4
DOIs
StatePublished - Mar 1 2005
EventProceedings of the 30th International Conference on Micro- and Nano-Engineering -
Duration: Sep 19 2004Sep 22 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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