Vibration damping of a cantilever beam utilizing fluidic flexible matrix composites

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

This paper presents a novel approach for damping the vibration of a cantilever beam by bonding a fluidic flexible matrix composite (F2MC) tube to the beam and using the strain induced fluid pumping. The transverse beam vibration couples with the F2MC tube strain to generate flow into an external accumulator through an orifice that dissipates energy. The energy dissipation is especially significant at the resonances of the cantilever beam, where the beam vibrates with greatest amplitude and induces the most fluid flow from the F2MC tube. As a result, the resonant peaks can be greatly reduced due to the damping introduced by the flow through the orifice. An analytical model is developed based on Euler-Bernoulli beam theory and Lekhnitskii's solution for anisotropic layered tubes. In order to maximize the vibration reduction, a parametric study of the F2MC tube is performed. The analysis results show that the resonant peaks can be provided with a damping ratio of up to 13.2% by tailoring the fiber angle of the F 2MC tube, the bonding locations of the tube, and the orifice flow coefficient.

Original languageEnglish (US)
Title of host publicationActive and Passive Smart Structures and Integrated Systems 2013
DOIs
StatePublished - 2013
EventActive and Passive Smart Structures and Integrated Systems 2013 - San Diego, CA, United States
Duration: Mar 10 2013Mar 14 2013

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8688
ISSN (Print)0277-786X

Other

OtherActive and Passive Smart Structures and Integrated Systems 2013
CountryUnited States
CitySan Diego, CA
Period3/10/133/14/13

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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