TY - JOUR
T1 - W-Band Complex Permittivity Measurements at High Temperature Using Free-Space Methods
AU - Hilario, Martin S.
AU - Hoff, Brad W.
AU - Jawdat, Benmaan
AU - Lanagan, Michael T.
AU - Cohick, Zane W.
AU - Dynys, Frederick W.
AU - Mackey, Jonathan A.
AU - Gaone, Joseph M.
N1 - Funding Information:
Manuscript received February 24, 2018; revised March 20, 2019; accepted April 12, 2019. Date of publication April 23, 2019; date of current version June 6, 2019. This work was supported by the Air Force Office of Scientific Research under Grant FA9550-17RDCOR449. Recommended for publication by Associate Editor M. Cases upon evaluation of reviewers’ comments. (Corresponding author: Brad W. Hoff.) M. S. Hilario, B. W. Hoff, and B. Jawdat are with the Air Force Research Laboratory, Kirtland Air Force Base (AFB), Albuquerque, NM 87117 USA (e-mail: brad.hoff@us.af.mil).
Publisher Copyright:
© 2011-2012 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - Free-space measurement techniques can be contactless and are able to accommodate large, flat sheets of dielectric material, making them useful for characterization of high-temperature, millimeter-wave, window and radome candidate materials. As part of the present work, a high-temperature, W-band (75-110 GHz), free-space measurement system was developed and used to characterize complex dielectric properties of bulk material samples at temperatures ranging from 25 °C to 600 °C. Two test cases, polyvinyl chloride (PVC) and CoorsTek 92% alumina, were measured at 25 °C and found to have €{r} values of 2.731 ± 0.005 and 8.061 ± 0.027 at 95 GHz, respectively. The 25 °C PVC sample was measured to have a €{r} value of 0.032 ± 0.007. At 25 °C, the €{r} value of the 92% alumina sample was below the uncertainty threshold achievable with the present free-space measurement apparatus and could only be bounded to <0.009. As the alumina sample was heated to 600 °C, €{r} and €{r} values increased to 8.501 ± 0.028 and 0.035 ± 0.008, respectively. The high-temperature behavior of the authors' 92% alumina ceramic was found to be similar to that previously documented for Sumitomo AKP-50 alumina over the 25 °C-600 °C temperature range. In addition to the 92% alumina sample, three commercially available ceramic substrates (zirconium oxide, boron nitride, and silicon nitride) were also characterized at temperatures ranging from 25 °C to 600 °C.
AB - Free-space measurement techniques can be contactless and are able to accommodate large, flat sheets of dielectric material, making them useful for characterization of high-temperature, millimeter-wave, window and radome candidate materials. As part of the present work, a high-temperature, W-band (75-110 GHz), free-space measurement system was developed and used to characterize complex dielectric properties of bulk material samples at temperatures ranging from 25 °C to 600 °C. Two test cases, polyvinyl chloride (PVC) and CoorsTek 92% alumina, were measured at 25 °C and found to have €{r} values of 2.731 ± 0.005 and 8.061 ± 0.027 at 95 GHz, respectively. The 25 °C PVC sample was measured to have a €{r} value of 0.032 ± 0.007. At 25 °C, the €{r} value of the 92% alumina sample was below the uncertainty threshold achievable with the present free-space measurement apparatus and could only be bounded to <0.009. As the alumina sample was heated to 600 °C, €{r} and €{r} values increased to 8.501 ± 0.028 and 0.035 ± 0.008, respectively. The high-temperature behavior of the authors' 92% alumina ceramic was found to be similar to that previously documented for Sumitomo AKP-50 alumina over the 25 °C-600 °C temperature range. In addition to the 92% alumina sample, three commercially available ceramic substrates (zirconium oxide, boron nitride, and silicon nitride) were also characterized at temperatures ranging from 25 °C to 600 °C.
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U2 - 10.1109/TCPMT.2019.2912837
DO - 10.1109/TCPMT.2019.2912837
M3 - Article
AN - SCOPUS:85067128832
SN - 2156-3950
VL - 9
SP - 1011
EP - 1019
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 6
M1 - 8697102
ER -