Wafer level EDMR: Magnetic resonance in a probing station

Duane J. Mccrory, Mark A. Anders, Jason T. Ryan, Pragya R. Shrestha, Jason P. Campbell, Patrick M. Lenahan, Kin P. Cheung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report on a novel semiconductor reliability technique that merges electrically detected magnetic resonance (EDMR) with a conventional semiconductor wafer probing station. This union with a semiconductor probing station allows EDMR measurements to be performed at the wafer level. Our measurements forgo a microwave cavity or resonator for a very small non-resonant near field microwave probe [1]. Bipolar amplification effect (BAE) [4] and spin dependent charge pumping (SDCP) [5] were demonstrated on various SiC MOSFET structures. These measurements were made via frequency-swept EDMR. The elimination of the resonance cavity, and incorporation with a wafer probing station, greatly simplifies the EDMR detection scheme and offers promise for widespread EDMR adoption in semiconductor reliability laboratories.

Original languageEnglish (US)
Title of host publication2017 IEEE International Integrated Reliability Workshop, IIRW 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781538623329
DOIs
StatePublished - May 18 2018
Event2017 IEEE International Integrated Reliability Workshop, IIRW 2017 - South Lake Tahoe, United States
Duration: Oct 8 2017Oct 12 2017

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2017-October

Other

Other2017 IEEE International Integrated Reliability Workshop, IIRW 2017
CountryUnited States
CitySouth Lake Tahoe
Period10/8/1710/12/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Mccrory, D. J., Anders, M. A., Ryan, J. T., Shrestha, P. R., Campbell, J. P., Lenahan, P. M., & Cheung, K. P. (2018). Wafer level EDMR: Magnetic resonance in a probing station. In 2017 IEEE International Integrated Reliability Workshop, IIRW 2017 (pp. 1-4). (IEEE International Integrated Reliability Workshop Final Report; Vol. 2017-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IIRW.2017.8361231