The viability of joining of titanium alloy using transient liquid phase (TLP) diffusion bonding was investigated. Commercially pure Ti (grade-2 Ti), and grade-5 (Ti Ti-6Al-4V) have been TLP bonded using silver or copper interlayers. The effect of joining parameters such as bonding temperature, and bonding time was evaluated. The intermetallics always formed in the joining area with a silver (Ag) interlayer. However, Cu interlayer was found to be a viable candidate for joining titanium alloy. At 1000°C or higher joining temperatures, no intermetallics was found in the microstructure of grade-2 Ti bonded area. The microstructure of bonded area was consisted of eutectic mixtures and Ti-Cu solid solutions. The microstructure of Ti-6Al-4V joint centerline was also consisted of eutectic of Cu-Ti and solid solution of Ti-Cu with other alloying elements. The maximum strength obtained for grade-2 Ti joint using Cu interlayer was 470±8 MPa.