Accurate and consistent test fixtures are important in industrial electronics manufacturing. Printed circuit board (PCB) level test fixtures can verify the manufacturability of a product prior to the installation in a final assembly. However, high risk factors in test station design can cause significant variability in measurements taken during the test process of products. This paper utilizes Lean tools such as fishbone and SIPOC diagrams to propose a process for investigating test stations for PCBs early in the product life cycle. A test methodology that uses materials of the end product is proposed to develop a test fixture. Statistical analysis is then conducted to identify the significant factors that affect the process. The proposed methodology was implemented in a real electronics manufacturing environment to address the test fixture design variability and provide an accurate test fixture at the time of the product release.