X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films

Hae Jeong Lee, Bryan Vogt, Christopher L. Soles, Da Wei Liu, Barry J. Bauer, Wen Li Wu, Eric K. Lin, Gwi Gwon Kang, Min Jin Ko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 Å in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100 % effective in generating pores.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE 2004 International Interconnect Technology Conference
Pages136-138
Number of pages3
Publication statusPublished - Nov 25 2004
EventProceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States
Duration: Jun 7 2004Jun 9 2004

Publication series

NameProceedings of the IEEE 2004 International Interconnect Technology Conference

Conference

ConferenceProceedings of the IEEE 2004 International Interconnect Technology Conference
CountryUnited States
CityBurlingame, CA
Period6/7/046/9/04

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All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Lee, H. J., Vogt, B., Soles, C. L., Liu, D. W., Bauer, B. J., Wu, W. L., ... Ko, M. J. (2004). X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films. In Proceedings of the IEEE 2004 International Interconnect Technology Conference (pp. 136-138). (Proceedings of the IEEE 2004 International Interconnect Technology Conference).