Y2BaCuO5as a infstrate for YBa2Cu3Ox

S. E. Dorris, Michael T. Lanagan, D. M. Moffatt, H. J. Leu, C. A. Youngdahl, U. Balachandran, A. Cazzato, D. E. Bloomberg, K. C. Goretta

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume % Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.

Original languageEnglish (US)
Pages (from-to)L1415-L1416
JournalJapanese Journal of Applied Physics
Volume28
Issue number8 A
DOIs
StatePublished - Aug 1 1989

Fingerprint

shrinkage
Tapes
tapes
Thermal expansion
thermal expansion
stiffness
sintering
Sintering
Stiffness
composite materials
Composite materials
room temperature
Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Dorris, S. E., Lanagan, M. T., Moffatt, D. M., Leu, H. J., Youngdahl, C. A., Balachandran, U., ... Goretta, K. C. (1989). Y2BaCuO5as a infstrate for YBa2Cu3Ox. Japanese Journal of Applied Physics, 28(8 A), L1415-L1416. https://doi.org/10.1143/JJAP.28.L1415
Dorris, S. E. ; Lanagan, Michael T. ; Moffatt, D. M. ; Leu, H. J. ; Youngdahl, C. A. ; Balachandran, U. ; Cazzato, A. ; Bloomberg, D. E. ; Goretta, K. C. / Y2BaCuO5as a infstrate for YBa2Cu3Ox. In: Japanese Journal of Applied Physics. 1989 ; Vol. 28, No. 8 A. pp. L1415-L1416.
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abstract = "Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume {\%} Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.",
author = "Dorris, {S. E.} and Lanagan, {Michael T.} and Moffatt, {D. M.} and Leu, {H. J.} and Youngdahl, {C. A.} and U. Balachandran and A. Cazzato and Bloomberg, {D. E.} and Goretta, {K. C.}",
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Dorris, SE, Lanagan, MT, Moffatt, DM, Leu, HJ, Youngdahl, CA, Balachandran, U, Cazzato, A, Bloomberg, DE & Goretta, KC 1989, 'Y2BaCuO5as a infstrate for YBa2Cu3Ox', Japanese Journal of Applied Physics, vol. 28, no. 8 A, pp. L1415-L1416. https://doi.org/10.1143/JJAP.28.L1415

Y2BaCuO5as a infstrate for YBa2Cu3Ox. / Dorris, S. E.; Lanagan, Michael T.; Moffatt, D. M.; Leu, H. J.; Youngdahl, C. A.; Balachandran, U.; Cazzato, A.; Bloomberg, D. E.; Goretta, K. C.

In: Japanese Journal of Applied Physics, Vol. 28, No. 8 A, 01.08.1989, p. L1415-L1416.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Y2BaCuO5as a infstrate for YBa2Cu3Ox

AU - Dorris, S. E.

AU - Lanagan, Michael T.

AU - Moffatt, D. M.

AU - Leu, H. J.

AU - Youngdahl, C. A.

AU - Balachandran, U.

AU - Cazzato, A.

AU - Bloomberg, D. E.

AU - Goretta, K. C.

PY - 1989/8/1

Y1 - 1989/8/1

N2 - Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume % Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.

AB - Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume % Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.

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Dorris SE, Lanagan MT, Moffatt DM, Leu HJ, Youngdahl CA, Balachandran U et al. Y2BaCuO5as a infstrate for YBa2Cu3Ox. Japanese Journal of Applied Physics. 1989 Aug 1;28(8 A):L1415-L1416. https://doi.org/10.1143/JJAP.28.L1415