Y2BaCuO5as a infstrate for YBa2Cu3Ox

S. E. Dorris, M. T. Lanagan, D. M. Moffatt, H. J. Leu, C. A. Youngdahl, U. Balachandran, A. Cazzato, D. E. Bloomberg, K. C. Goretta

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Abstract

Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume % Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.

Original languageEnglish (US)
Pages (from-to)L1415-L1416
JournalJapanese Journal of Applied Physics
Volume28
Issue number8 A
DOIs
StatePublished - Aug 1 1989

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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    Dorris, S. E., Lanagan, M. T., Moffatt, D. M., Leu, H. J., Youngdahl, C. A., Balachandran, U., Cazzato, A., Bloomberg, D. E., & Goretta, K. C. (1989). Y2BaCuO5as a infstrate for YBa2Cu3Ox. Japanese Journal of Applied Physics, 28(8 A), L1415-L1416. https://doi.org/10.1143/JJAP.28.L1415